Efficient generation of fill shapes for chips and packages
US5636133A · kind A · utility
43Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1995 |
| Grant date | Jun 3, 1997 |
| Priority date | — |
| Expiry date | May 19, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/398
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An efficient method for modifying a chip or package design allows for the creation of small shapes without excessive expansion of design data. A computer program takes a physical design, represented in a computer data file, and generates a modified version of the design in which fill shapes have been added. Subsequently, when the modified design is processed, the resulting semiconductor chip or package will contain physical images of the added fill shapes, with the effect of making local pattern density more uniform and hence reducing process-induced variations in feature size and shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.