Lead frame assembly for a semiconductor device
US5637917A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1996 |
| Grant date | Jun 10, 1997 |
| Priority date | — |
| Expiry date | Apr 3, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame assembly for a semiconductor device includes a lead frame having a lead frame main body and a first welding region, and a die pad frame having a die pad frame main body, a die pad frame, and a second welding region for welding to the first welding region of said lead frame main body. At least one of the first and second welding regions includes a welding pad for welding to the other welding region and a support bridge connected between the welding pad and a respective frame main body, supporting the welding pad from the respective frame main body, the support bridge including an element for suppressing transmission of at least one of mechanical force, heat, and electrical current.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.