Inventor · Tsukuba, JP

Yoshihiro Tomita

133Patents
24h-index
166Co-inventors
93Inventor score

Filing activity: Dec 18, 1987 → Jul 25, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US5771555A Method for producing an electronic component using direct bonding Emerging Cross-Sectional Technologies 232 Expired
US5666008A Flip chip semiconductor device Electricity 102 Expired
US5900582A Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame Emerging Cross-Sectional Technologies 84 Expired
US6084294A Semiconductor device comprising stacked semiconductor elements Electricity 80 Expired
US5440169A Resin-packaged semiconductor device with flow prevention dimples Electricity 73 Expired
US5666706A Method of manufacturing a piezoelectric acoustic wave device Emerging Cross-Sectional Technologies 68 Expired
US5969463A Energy trapping piezoelectric device and producing method thereof Electricity 68 Expired
US5535509A Method of making a lead on chip (LOC) semiconductor device Emerging Cross-Sectional Technologies 53 Expired
US5759753A Piezoelectric device and method of manufacturing the same Electricity 47 Expired
US5647932A Method of processing a piezoelectric device Emerging Cross-Sectional Technologies 45 Expired
US6459152B1 Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface Electricity 45 Expired
US5982010A Piezoelectric device and method of manufacturing the same Electricity 38 Expired
US5929555A Piezoelectric resonator and method for fabricating the same Emerging Cross-Sectional Technologies 34 Expired
US5372295A Solder material, junctioning method, junction material, and semiconductor device Electricity 33 Expired
US5910699A Method of manufacturing a composite substrate and a piezoelectric device using the substrate Emerging Cross-Sectional Technologies 33 Expired
US6270202A Liquid jetting apparatus having a piezoelectric drive element directly bonded to a casing Performing Operations; Transporting 32 Expired
US6344682B1 Semiconductor device comprising a semiconductor element mounted on a substrate and covered by a wiring board Electricity 32 Expired
US5763829A Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe Emerging Cross-Sectional Technologies 32 Expired
US4831636A Coding transmission equipment for carrying out coding with adaptive quantization Electricity 30 Expired
US6098460A Acceleration sensor and shock detecting device using the same Emerging Cross-Sectional Technologies 28 Expired
US5159611A Variable rate coder Electricity 28 Expired
US5698471A Method of manufacturing a composite substrate and a piezoelectric device using the substrate Emerging Cross-Sectional Technologies 27 Expired
US5925973A Electronic component and method for producing the same Emerging Cross-Sectional Technologies 26 Expired
US5986336A Semiconductor device including a heat radiation plate Electricity 24 Expired
US5959353A Semiconductor device Electricity 23 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.