Microelectronic module having optical and electrical interconnects
US5638469A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Aug 16, 1993 |
| Grant date | Jun 10, 1997 |
| Priority date | — |
| Expiry date | Aug 16, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate. The optical transmitter and detector may be mounted on/in the substrate or on/in the integrated circuit chips. The optical transmitter and detector may also be used to provide optical connecti…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.