MCNC
97Patents
0Active
97Granted
43Portfolio score
Filing activity: Nov 29, 1988 → Dec 31, 2002
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5475280A | Vertical microelectronic field emission devices | Electricity | 308 | Expired |
| US5914801A | Microelectromechanical devices including rotating plates and related methods | Emerging Cross-Sectional Technologies | 200 | Expired |
| US5955817A | Thermal arched beam microelectromechanical switching array | Emerging Cross-Sectional Technologies | 171 | Expired |
| US5767010A | Solder bump fabrication methods and structure including a titanium barrier layer | Electricity | 166 | Expired |
| US5325265A | High performance integrated circuit chip package | Electricity | 158 | Expired |
| US5289631A | Method for testing, burn-in, and/or programming of integrated circuit chips | Emerging Cross-Sectional Technologies | 155 | Expired |
| US5909078A | Thermal arched beam microelectromechanical actuators | Electricity | 127 | Expired |
| US6590267B1 | Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods | Electricity | 125 | Expired |
| US6057520A | Arc resistant high voltage micromachined electrostatic switch | Electricity | 123 | Expired |
| US6456420B1 | Microelectromechanical elevating structures | Electricity | 117 | Expired |
| US5994816A | Thermal arched beam microelectromechanical devices and associated fabrication methods | Emerging Cross-Sectional Technologies | 116 | Expired |
| US5206557A | Microelectromechanical transducer and fabrication method | Electricity | 114 | Expired |
| US5638469A | Microelectronic module having optical and electrical interconnects | Electricity | 114 | Expired |
| US5740258A | Active noise supressors and methods for use in the ear canal | Physics | 113 | Expired |
| US6229683A | High voltage micromachined electrostatic switch | Electricity | 111 | Expired |
| US6617643B1 | Low power tunneling metal-oxide-semiconductor (MOS) device | Electricity | 109 | Expired |
| US5162257A | Solder bump fabrication method | Emerging Cross-Sectional Technologies | 104 | Expired |
| US5144191A | Horizontal microelectronic field emission devices | Electricity | 102 | Expired |
| US6124663A | Fiber optic connector having a microelectromechanical positioning apparatus and an associated fabrication method | Physics | 86 | Expired |
| US5962949A | Microelectromechanical positioning apparatus | Electricity | 82 | Expired |
| US6377438B1 | Hybrid microelectromechanical system tunable capacitor and associated fabrication methods | Performing Operations; Transporting | 81 | Expired |
| US6373682B1 | Electrostatically controlled variable capacitor | Electricity | 81 | Expired |
| US5112439A | Method for selectively depositing material on substrates | Emerging Cross-Sectional Technologies | 79 | Expired |
| US6023121A | Thermal arched beam microelectromechanical structure | Emerging Cross-Sectional Technologies | 76 | Expired |
| US5963793A | Microelectronic packaging using arched solder columns | Electricity | 72 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.