Assembly and method for making in process thin film thickness measurments
US5640242A · kind A · utility
56Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1996 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | Jan 31, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0683
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An assembly for making thickness measurements in a thin film structure. The assembly comprises a chemical-mechanical planarization (CMP) subassembly for effecting topographical changes in a thin film structure; and, a measuring subassembly for detecting the thickness of a thin film structure, the measuring subassembly interposed with the CMP subassembly so that a thickness measurement can be made during and independent of CMP process operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.