Apparatus and method for automated non-destructive inspection of integrated circuit packages
US5641906A · kind A · utility
14Cited by
30References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2698
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method are disclosed for producing acoustical reflected images from selected planes within an integrated circuit package to detect flaws within the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.