Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer
US5643046A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1995 |
| Grant date | Jul 1, 1997 |
| Priority date | — |
| Expiry date | Feb 17, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method and apparatus are provided for detecting the polishing end point of a semi-conductor wafer having a polishing film and a stopper film formed thereon. First driving means are provided having a first drive shaft for rotating a polishing plate and a polishing cloth thereon. Second driving means having a second rotatable drive shaft are also provided. Mounting means for mounting the semi-conductor wafer is adapted to be rotated by the second driving means for polishing the wafer. Energy supplying means for supplying prescribed energy to the semi-conductor wafer are also included. Finally, detecting means for detecting a polishing end point of the polishing film is included and detects a variation of the energy supplied to the semi-conductor wafer. Different types of energy can be utilized such as infrared light and a vibration wave.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.