Patent · US Expired

Method for manufacturing a semiconductor device

US5643826A · kind A · utility

1,362Cited by
15References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 25, 1994
Grant dateJul 1, 1997
Priority date
Expiry dateOct 25, 2014

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S148/016
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A process for fabricating a highly stable and reliable semiconductor, comprising: coating the surface of an amorphous silicon film with a solution containing a catalyst element capable of accelerating the crystallization of the amorphous silicon film, and heat treating the amorphous silicon film thereafter to crystallize the film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.