Integrated circuit package assemblies including an electrostatic discharge interposer
US5644167A · kind A · utility
39Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1996 |
| Grant date | Jul 1, 1997 |
| Priority date | — |
| Expiry date | Mar 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package assembly incorporating an electrostatic discharge (ESD) interposer is disclosed. The assembly includes a semiconductor chip including a plurality of chip input/output terminals. The interposer is formed using a substrate which supports the chip and includes an arrangement having a plurality of integrally formed ESD protection circuits for providing ESD protection to predetermined ones of the chip input/output terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.