Semiconductor device having temperature regulation means formed in circuit board
US5645123A · kind A · utility
13Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1994 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Dec 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3431
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to the present invention includes a resistant heating element as a temperature regulation means on a circuit board. A semiconductor chip of the device is connected to the circuit board through connecting electrodes. A difference in temperature between the semiconductor chip and circuit board is kept at a fixed value by controlling the resistant heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.