Patent · US Expired

Suspension for micromechanical structure and micromechanical acceleration sensor

US5646347A · kind A · utility

22Cited by
2References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 31, 1995
Grant dateJul 8, 1997
Priority date
Expiry dateAug 31, 2015

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01P2015/0814
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A suspension or an acceleration sensor having a suspension is proposed, by means of which a micromechanical structure or the acceleration sensor is anchored on a substrate. The suspension takes place by means of lever elements on which an equalizing beam acts. The lever elements are deformed by the stresses in the equalizing beam with respect to the substrate in such a way that the stresses in the microstructure with respect to the substrate are either compensated for or, alternatively, are converted from compressive stresses to tensile stresses or from tensile stresses to compressive stresses.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.