Suspension for micromechanical structure and micromechanical acceleration sensor
US5646347A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1995 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Aug 31, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0814
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A suspension or an acceleration sensor having a suspension is proposed, by means of which a micromechanical structure or the acceleration sensor is anchored on a substrate. The suspension takes place by means of lever elements on which an equalizing beam acts. The lever elements are deformed by the stresses in the equalizing beam with respect to the substrate in such a way that the stresses in the microstructure with respect to the substrate are either compensated for or, alternatively, are converted from compressive stresses to tensile stresses or from tensile stresses to compressive stresses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.