Michael Offenberg
37Patents
22h-index
40Co-inventors
81Inventor score
Filing activity: Jun 17, 1992 → Jul 9, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5683591A | Process for producing surface micromechanical structures | Performing Operations; Transporting | 219 | Expired |
| US5578755A | Accelerometer sensor of crystalline material and method for manufacturing the same | Physics | 138 | Expired |
| US5723353A | Process for manufacturing a sensor | Emerging Cross-Sectional Technologies | 71 | Expired |
| US5616514A | Method of fabricating a micromechanical sensor | Physics | 64 | Expired |
| US5627317A | Acceleration sensor | Physics | 54 | Expired |
| US5756901A | Sensor and method for manufacturing a sensor | Physics | 53 | Expired |
| US6318175A | Micromechanical sensor and method for the manufacture thereof | Physics | 50 | Expired |
| US5937275A | Method of producing acceleration sensors | Physics | 48 | Expired |
| US6214243A | Process for producing a speed of rotation coriolis sensor | Performing Operations; Transporting | 44 | Expired |
| US5574222A | Acceleration sensor | Physics | 43 | Expired |
| US5959208A | Acceleration sensor | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5631422A | Sensor comprising multilayer substrate | Physics | 41 | Expired |
| US5616523A | Method of manufacturing sensor | Physics | 41 | Expired |
| US6117701A | Method for manufacturing a rate-of-rotation sensor | Physics | 39 | Expired |
| US5983721A | Micromechanical component having closely spaced apart anchoring areas for a surface structure disposed thereon | Physics | 36 | Expired |
| US5569852A | Capacitive accelerometer sensor and method for its manufacture | Physics | 36 | Expired |
| US6055858A | Acceleration sensor | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6187607A | Manufacturing method for micromechanical component | Performing Operations; Transporting | 26 | Expired |
| US5452610A | Mass-flow sensor | Physics | 24 | Expired |
| US6140709A | Bonding pad structure and method for manufacturing the bonding pad structure | Electricity | 23 | Expired |
| US5310450A | Method of making an acceleration sensor | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5646347A | Suspension for micromechanical structure and micromechanical acceleration sensor | Physics | 22 | Expired |
| US5542558A | Method for manufacturing micro-mechanical components using selective anodization of silicon | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6936902B2 | Sensor with at least one micromechanical structure and method for production thereof | Performing Operations; Transporting | 19 | Expired |
| US5461917A | Acceleration sensor | Physics | 14 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.