Support posts for micro-mechanical devices
US5646768A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S359/90
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An improved support post (16, 23, 25) for micro-mechanical devices (10). A via (34a) that defines the outer surface of the support post (16) is etched into a spacer layer (34). An oxide layer (41) is conformally deposited over the spacer layer (34) and into the via (34a), and then etched back to the top surface of the spacer layer (34), leaving a sidewall ring (23a) on the inner surface of the via (34a). Next, a metal layer (61) is deposited over the spacer layer (34) and into the via (34a) so as to cover the sidewall ring (23a). This metal layer (61) is then etched to form a support post stem (23) inside the via (34a). The spacer layer (34) is removed, leaving the support post stem (23) and a sidewall ring (23a) around the stem (23).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.