Device for coating substrates in semiconductor production

US5650196A · kind A · utility

Assignee

• Steag Micro Tech GmbH · DE

Inventors

• Eberhard Mühlfriedel · Maulbronn, DE
• Karl Appich · Maulbronn, DE
• Martin Kallis · Mühlacker, DE

Key dates

• Filing date: Jun 30, 1994
• Grant date: Jul 22, 1997
• Expiry date: Jun 30, 2014

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B05D1/26
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A device for coating substrates has a capillary slot which is used in a first step to apply lacquer to the substrate. In a second step, the lacquer layer thickness of the substrate is reduced and made more uniform by spinning in a spinning device.