High-resolution negative photoresist with wide process latitude
US5650262A · kind A · utility
Inventors
Key dates
| Filing date | Apr 5, 1995 |
| Grant date | Jul 22, 1997 |
| Priority date | — |
| Expiry date | Apr 5, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/122
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to a chemically amplified negative photoresist which can be developed in aqueous alkaline media, which contains a radiation-sensitive acid generator and a compound which reduces the solubility of the resist in aqueous alkaline solutions in the presence of acid, and a polyhydroxyl compound of the formula I ##STR1## in which n is an integer between 2 and 6, PA1 R is hydrogen, halogen, C.sub.1 -C.sub.4 alkoxy or C.sub.1 -C.sub.4 alkyl, and PA1 Z is an n-valent radical which is unsubstituted or substituted by one or more substituents from the group consisting of hydroxyl, halogen and C.sub.1 -C.sub.4 alkoxy, and is selected from the group consisting of: PA2 a) aliphatic radicals having 1 to 12 carbon atoms, PA2 b) cycloaliphatic radicals having 5 to 20 carbon atoms, PA2 c) aromatic radicals having 6 to 20 carbon atoms and PA2 d) radicals having 7 to 30 carbon atoms which comprise at least two different structural units selected from aliphatic, cycloaliphatic or aromatic groups. The resists described make it possible to reduce the demands made on the focusing accuracy during imagewise exposure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.