Electronic package with improved thermal properties
US5650663A · kind A · utility
246Cited by
10References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 3, 1995 |
| Grant date | Jul 22, 1997 |
| Priority date | — |
| Expiry date | Jul 3, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package having improved thermal performance. In the case of a plastic package, the inner ends of the leads of the lead frame are attached to a heat slug by a high thermal conductivity material such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the leadframe are attached to the metal base component by a high thermal conductivity material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.