Composite plating method
US5651872A · kind A · utility
11Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1995 |
| Grant date | Jul 29, 1997 |
| Priority date | — |
| Expiry date | Oct 6, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D15/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composite plating film is prepared from a composite plating solution containing a metal matrix and insoluble particles 4 dispersed therein or deposited therewith. The composite plating film has a non-uniform concentration of insoluble particles along a direction of the thickness of the composite film. The non-uniform concentration is achieved by changing the discharge rate of composite plating solution during deposition of the film on the base material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.