Semiconductor device and package structure therefore and power inverter having semiconductor device
US5652467A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1995 |
| Grant date | Jul 29, 1997 |
| Priority date | — |
| Expiry date | Jul 27, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An auxiliary cathode lead is contacted to a cathode buffer electrode which contacts to an unit GTO arranged at the most remote region from a gate pressure contacting portion of a GTO pellet and the push-into effect of the auxiliary cathode current during the turn-off can be remarkably performed. Without inviting bad affects such as the increase in "on" voltage, it is proposed a package structure of a semiconductor which the unit GTO arranged remote from a gate is easily to perform the turn-off. The maximum turn-off current can be heightened, it can easily correspond to the increase in the diameter of the pellet according to the large current of the unit element. Further, a condenser of a snubber circuit as a protection circuit of the unit GTO in a power inverter can be small, and the snubber loss can be lessened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.