Patent · US Expired

High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates

US5652645A · kind A · utility

89Cited by
3References
37Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 24, 1995
Grant dateJul 29, 1997
Priority date
Expiry dateJul 24, 2015

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/1545
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A projection imaging system is described for patterning large, flexible substrates at high exposure speeds and desired resolution, the substrates being in the form of a continuous band fed from a roller for cost-effective electronic module manufacturing. From the continuous band, segments of one panel size are sequentially exposed one at a time. The segment being exposed is held rigidly on a scanning stage, on which is also mounted a mask containing the pattern to be formed on the substrate. The imaging subsystem is stationary and situated above the scanning stage. The mask is illuminated with a hexagonal illumination beam and a region of similar shape is imaged on the substrate. The stage is programmed to scan the mask and substrate simultaneously across the hexagonal regions so as to pattern one whole panel. Provision is made for suitable overlap between the complementary intensity profiles produced by the hexagonal illumination, which ensures seamless joining of the scans and uniform patterning of an entire panel without image stitching errors. For handling the roll substrate so that the substrate segment being exposed remains held rigidly to the scanning stage while the stage m…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.