Method for forming semiconductor chip and electronic module with integrated surface interconnects/components
US5654221A · kind A · utility
53Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1995 |
| Grant date | Aug 5, 1997 |
| Priority date | — |
| Expiry date | Apr 10, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fabrication method and resultant electronic module having one or more surfaces enhanced with interconnects and components. Electronic modules having, for example, resistors and capacitors integral with a side surface thereof are disclosed. Further described are electronic modules with interconnects electrically attaching for example, side to side, or side to end surfaces are described. Moreover, discussion of an electronic module having a Silicon Front Face chip is contained herein. Specific details of the fabrication method, resulting electronic module, and related wafer processing are set forth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.