High thermal resistance backfill material for hybrid UFPA's
US5656848A · kind A · utility
24Cited by
12References
7Claims
0Family size
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Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A porous film 64 is used to thermally insulate sensing integrated circuitry 44 from pixels 34 of an uncooled IR detector hybrid system 30. The porous film 64 is preferably a silicon-dioxide xerogel. A protective film 65 may be deposited on the porous film 64.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.