Solder interconnection structure
US5656862A · kind A · utility
55Cited by
5References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1993 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | May 6, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31547
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.