Close physical mounting of leaded amplifier/receivers to through holes in monolithic, buried-substrate, multiple capacitors simultaneous with electrical connection to dual capacitors otherwise transpiring, particularly for hearing aid filters
US5657199A · kind A · utility
Inventors
Key dates
| Filing date | Sep 15, 1995 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | Sep 15, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Leaded electrical circuits and components, typically receivers and amplifiers used in micro-miniature hearing aids, are closely physically mounted by their leads extending within laser-drilled through-holes, typically three such holes, to multiple buried-substrate capacitors within a monolithic ceramic multiple capacitor. Electrical connection to the leads does not transpire within the holes, but rather though soldered or like connection to conductive pads surrounding the holes and continuing first as circuit traces on the top of the monolith, and then as electrically-conductive trace or castellations on the sides of the monolith, until reaching electrodes of the buried-substrate capacitors patterned so as to be brought to side surfaces of the monolith. The direct electrical connection is normally to multiple plates of plural buried-substrate capacitors, typically including a relatively large, typically 1.0 .mu.farad, capacitor in electrical parallel with a smaller, typically 100 picofarads, capacitor. Both capacitances jointly serve as an effective filter to noise in two separate frequency bands, typically centered about 100 kHz and about 100 MHz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.