Daniel Devoe
22Patents
14h-index
3Co-inventors
70Inventor score
Filing activity: Oct 21, 1992 → Nov 11, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6587327B1 | Integrated broadband ceramic capacitor array | Electricity | 145 | Expired |
| US6816356B2 | Integrated broadband ceramic capacitor array | Electricity | 67 | Expired |
| US6081416A | Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic | Electricity | 42 | Expired |
| US6542352B1 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Electricity | 40 | Expired |
| US6970341B1 | Integrated broadband ceramic capacitor array | Electricity | 40 | Expired |
| US5367430A | Monolithic multiple capacitor | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6545854B2 | Fringe-field non-overlapping-electrodes discoidal feed-through ceramic filter capacitor with high breakdown voltage | Electricity | 32 | Expired |
| US6366443B1 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY-SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY-TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Electricity | 29 | Expired |
| US6753218B2 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Electricity | 28 | Expired |
| US7633739B2 | Stacked multilayer capacitor | Emerging Cross-Sectional Technologies | 21 | Active |
| US7307829B1 | Integrated broadband ceramic capacitor array | Electricity | 19 | Expired |
| US5657199A | Close physical mounting of leaded amplifier/receivers to through holes in monolithic, buried-substrate, multiple capacitors simultaneous with electrical connection to dual capacitors otherwise transpiring, particularly for hearing aid filters | Electricity | 18 | Expired |
| US6751082B2 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Electricity | 15 | Expired |
| US6760215B2 | Capacitor with high voltage breakdown threshold | Electricity | 15 | Expired |
| US6619763B2 | Feed-through filter capacitor with non-overlapping electrodes | Electricity | 14 | Expired |
| US5740010A | Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors | Electricity | 14 | Expired |
| US5625528A | Monolithic, buried-substrate, ceramic multiple capacitors isolated, one to the next, by dual-dielectric-constant, three-layer-laminate isolation layers | Electricity | 13 | Expired |
| US7075776B1 | Integrated broadband ceramic capacitor array | Electricity | 13 | Expired |
| US7035080B1 | Combined multilayer and single-layer capacitor for wirebonding | Electricity | 8 | Expired |
| US6690558B1 | Power resistor and method for making | Electricity | 6 | Expired |
| US8289675B2 | Stacked multilayer capacitor | Emerging Cross-Sectional Technologies | 6 | Active |
| US6917509B1 | Single layer capacitor with dissimilar metallizations | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.