Process for electrically connecting electrical devices using a conductive anisotropic material
US5661042A · kind A · utility
51Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1995 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Aug 28, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/323
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for using removable Z-axis anisotropically conductive adhesive material (21) which includes water, a matrix resin (23), and conductive spheres (22). The material (21) is suitable for providing temporary contact between electronic devices. In one embodiment, the material (21) is used to temporarily bond a semiconductor wafer (11) to a probe substrate (12) for wafer-level burn-in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.