Controllable power semiconductor component

US5661315A · kind A · utility

Assignee

• Asea Brown Boveri, S.A. · CH

Inventors

• Friedhelm Bauer · Suhr, CH
• Reinhold Bayerer · Warstein, DE
• Thomas Stockmeier · Baden, CH

Key dates

• Filing date: Dec 28, 1995
• Grant date: Aug 26, 1997
• Expiry date: Dec 28, 2015

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D12/441

Abstract

In the case of a controllable power semiconductor component, which comprises at least one planar, essentially rectangular power semiconductor chip (13), which power semiconductor chip (13) has on its top side a large-area metallization layer (14) for the large-area electrical connection to a metal mating element (17, 19), and also a separate small-area connection region for the gate connection in the form of a gate pad (16), a simplified form of the metal mating element (17, 19) and adjustment thereof are achieved by virtue of the fact that the gate pad (16) is arranged in a corner of the power semiconductor chip (13).