Thin multichip module
US5661339A · kind A · utility
Inventor
Key dates
| Filing date | Jul 11, 1994 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Jul 11, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved semiconductor module comprising a molded frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the composite semiconductor substrate sub-assembly includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the composite semiconductor substrate subassembly, comprising a cover plate with the composite substrate attached thereto, is attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. The composite substrate employed in the present invention offers the advantage of allowing the components to be pre-assembled, tested and repaired prior to fi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.