James E. Clayton
45Patents
17h-index
23Co-inventors
81Inventor score
Filing activity: Jun 12, 1986 → Jan 6, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5708297A | Thin multichip module | Emerging Cross-Sectional Technologies | 182 | Expired |
| US4656605A | Single in-line memory module | Electricity | 180 | Expired |
| US5751553A | Thin multichip module including a connector frame socket having first and second apertures | Emerging Cross-Sectional Technologies | 168 | Expired |
| US4850892A | Connecting apparatus for electrically connecting memory modules to a printed circuit board | Electricity | 140 | Expired |
| US6410415B1 | Flip chip mounting technique | Electricity | 135 | Expired |
| US6049975A | Method of forming a thin multichip module | Emerging Cross-Sectional Technologies | 120 | Expired |
| US5661339A | Thin multichip module | Electricity | 115 | Expired |
| US5731633A | Thin multichip module | Emerging Cross-Sectional Technologies | 101 | Expired |
| US6232659A | Thin multichip module | Emerging Cross-Sectional Technologies | 101 | Expired |
| US7796399B2 | Thin multi-chip flex module | Emerging Cross-Sectional Technologies | 93 | Active |
| US6091145A | Thin multichip module including a connector frame socket | Emerging Cross-Sectional Technologies | 84 | Expired |
| US4727513A | Signal in-line memory module | Electricity | 83 | Expired |
| US6665190B2 | Modular PC card which receives add-in PC card modules | Electricity | 49 | Expired |
| US7393226B2 | Thin multichip flex-module | Electricity | 32 | Active |
| US8929054B2 | Use of organic and organometallic high dielectric constant material for improved energy storage devices and associated methods | Emerging Cross-Sectional Technologies | 24 | Active |
| US9023249B2 | Adhesive bonding composition and method of use | Emerging Cross-Sectional Technologies | 21 | Active |
| US7394149B2 | Thin multichip flex-module | Electricity | 19 | Active |
| US7429788B2 | Thin multichip flex-module | Electricity | 17 | Active |
| US7724530B2 | Thin multi-chip flex module | Emerging Cross-Sectional Technologies | 15 | Active |
| US7787254B2 | Thin multichip flex-module | Electricity | 14 | Active |
| US7520781B2 | Thin multichip flex-module | Electricity | 13 | Active |
| US8899994B2 | Compression connector system | Electricity | 13 | Active |
| US8559181B2 | Thin multi-chip flex module | Emerging Cross-Sectional Technologies | 10 | Active |
| US10283476B2 | Adhesive bonding composition and electronic components prepared from the same | Emerging Cross-Sectional Technologies | 7 | Active |
| US10074627B2 | Adhesive bonding composition and electronic components prepared from the same | Emerging Cross-Sectional Technologies | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.