High-frequency wireless communication system on a single ultrathin silicon on sapphire chip
US5663570A · kind A · utility
104Cited by
23References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1995 |
| Grant date | Sep 2, 1997 |
| Priority date | — |
| Expiry date | May 19, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high-frequency wireless communication system on a single ultrathin silicon on sapphire chip is presented. This system incorporates analog, digital (logic and memory) and high radio frequency circuits on a single ultrathin silicon on sapphire chip. The devices are fabricated using conventional bulk silicon CMOS processing techniques. Advantages include single chip architecture, superior high frequency performance, low power consumption and cost effective fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.