Ball grid array type of semiconductor device
US5663594A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 15, 1995 |
| Grant date | Sep 2, 1997 |
| Priority date | — |
| Expiry date | Nov 15, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid type of semiconductor device is provided which includes a semiconductor chip having a plurality of electrode pads. In one preferred embodiment, the semiconductor chip is adhered to a plurality of corresponding planar metal leads via an insulator. The plurality of electrode pads and the plurality of corresponding metal leads are bonded by wires. The semiconductor chip and the plurality of metal leads are sealed together with the wires with a material. A predetermined number of holes passing through the seal to the plurality of metal leads are formed by a laser beam or a drill. Then, solder bails are melted to connect each of the solder balls to a corresponding one of the plurality of metal leads. Finally, the plurality of metal leads are cut at the outer surface of the seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.