Naoto Kimura
48Patents
13h-index
15Co-inventors
78Inventor score
Filing activity: Oct 23, 1991 → Sep 29, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6218728A | Mold-BGA-type semiconductor device and method for making the same | Electricity | 181 | Expired |
| US5663594A | Ball grid array type of semiconductor device | Electricity | 39 | Expired |
| US6600221B2 | Semiconductor device with stacked semiconductor chips | Electricity | 39 | Expired |
| US6028356A | Plastic-packaged semiconductor integrated circuit | Emerging Cross-Sectional Technologies | 34 | Expired |
| US7030505B2 | Resin-sealed-type semiconductor device, and production process for producing such semiconductor device | Electricity | 24 | Expired |
| US6744141B2 | Stacked chip-size package type semiconductor device capable of being decreased in size | Electricity | 23 | Expired |
| US5715593A | Method of making plastic-packaged semiconductor integrated circuit | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5962918A | Semiconductor device having simple protective structure and process of fabrication thereof | Electricity | 22 | Expired |
| US5168805A | Screen printing method and method of producing screen printing plates | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6621156B2 | Semiconductor device having stacked multi chip module structure | Electricity | 15 | Expired |
| US6476500B2 | Semiconductor device | Electricity | 15 | Expired |
| US6690090B2 | Semiconductor device having reliable coupling with mounting substrate | Electricity | 14 | Expired |
| US6984889B2 | Semiconductor device | Electricity | 13 | Expired |
| US6734553B2 | Semiconductor device | Electricity | 11 | Expired |
| US6268652A | CSP type semiconductor device with reduced package size | Electricity | 8 | Expired |
| US6239376A | Coated fine metallic wire and method for fabricating semiconductor device using same | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6640436B1 | Method of fabricating a coated metallic wire, method of removing insulation from the coated metallic wire and method of fabricating a semiconductor device with the wire | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6933612B2 | Semiconductor device with improved heatsink structure | Electricity | 5 | Expired |
| US6605869B2 | Semiconductor device with improved cooling efficiency and reduced electric resistance | Electricity | 5 | Expired |
| US6011306A | Semiconductor device and method for fabricating same | Electricity | 4 | Expired |
| US7432588B2 | Semiconductor device and method of fabricating the same | Electricity | 3 | Expired |
| US6575348B2 | Wire bonding apparatus with spurious vibration suppressing structure | Electricity | 3 | Expired |
| US6331738A | Semiconductor device having a BGA structure | Electricity | 2 | Expired |
| US9542734B2 | Information processing apparatus, image processing method, and storage medium that determine tone characteristics for respective object signals | Electricity | 2 | Active |
| US6472759B1 | Ball grid array type semiconductor device | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.