Electrical circuit bonding interconnect component and flip chip interconnect bond
US5663598A · kind A · utility
86Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1995 |
| Grant date | Sep 2, 1997 |
| Priority date | — |
| Expiry date | Oct 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10984
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bonding interconnect is used to bond a die pad to a supporting substrate thereby forming a surface mount device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.