Substrate processing method and substrate processing apparatus
US5665200A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 7, 1995 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | Sep 7, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70691
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a substrate processing method including the coating step of coating a processing liquid on an object to be processed in a first processing unit of a processing chamber having first and second processing units, the step of conveying the object from the first processing unit to the second processing unit, the rinse step of rinsing an unnecessary processing liquid remaining on a peripheral portion of the object in the second processing unit to remove the unnecessary processing liquid, and the exposure step of conveying the rinsed object to an exposure apparatus to perform exposure processing for the object, wherein a time from the end of the rinse step for one object to be processed to the end of the rinse step for a next object to be processed is shorter than a time required for the exposure step for the one object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.