Package for mounting a semiconductor device
US5665473A · kind A · utility
38Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1995 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | Sep 12, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for mounting a semiconductor device comprises a base plate and a conductive layer laminated onto the base plate via an adhesive layer. The modulus of elasticity at 25.degree. C. of the adhesive layer is 10 kg/mm.sup.2 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.