Tokio Okoshi
2Patents
2h-index
7Co-inventors
37Inventor score
Filing activity: Nov 5, 1980 → Sep 12, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5665473A | Package for mounting a semiconductor device | Emerging Cross-Sectional Technologies | 38 | Expired |
| US4370421A | Electrically insulating substrate and a method of making such a substrate | Electricity | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.