Method and apparatus for polishing a semiconductor substrate wafer
US5665656A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 17, 1995 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | May 17, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer polishing apparatus includes a housing and a turntable mounted in the housing. The turntable has an axis of rotation and a surface for affixing a semiconductor wafer. The polishing apparatus also includes a motor mounted to the housing and connected to the turntable to supply a torque for rotating the turntable about the axis of rotation. A polishing assembly is connected to the housing and extends adjacent to the turntable surface. A polishing pad is affixed to the polishing assembly and is positionable to contact the semiconductor wafer. Some polishing pads are cylindrical in form. Other polishing pads have a conical form.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.