Rahul Jairath
19Patents
15h-index
26Co-inventors
78Inventor score
Filing activity: Dec 16, 1994 → Jul 30, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5762536A | Sensors for a linear polisher | Performing Operations; Transporting | 115 | Expired |
| US5478435A | Point of use slurry dispensing system | Performing Operations; Transporting | 113 | Expired |
| US6111634A | Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing | Electricity | 103 | Expired |
| US5614444A | Method of using additives with silica-based slurries to enhance selectivity in metal CMP | Electricity | 91 | Expired |
| US6146248A | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher | Electricity | 73 | Expired |
| US5866031A | Slurry formulation for chemical mechanical polishing of metals | Chemistry; Metallurgy | 61 | Expired |
| US6108091A | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing | Physics | 59 | Expired |
| US6328642A | Integrated pad and belt for chemical mechanical polishing | Performing Operations; Transporting | 51 | Expired |
| US5857899A | Wafer polishing head with pad dressing element | Performing Operations; Transporting | 33 | Expired |
| US5913714A | Method for dressing a polishing pad during polishing of a semiconductor wafer | Performing Operations; Transporting | 25 | Expired |
| US6261155A | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher | Electricity | 24 | Expired |
| US5665656A | Method and apparatus for polishing a semiconductor substrate wafer | Performing Operations; Transporting | 22 | Expired |
| US6336845B1 | Method and apparatus for polishing semiconductor wafers | Performing Operations; Transporting | 22 | Expired |
| US6621584B2 | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing | Physics | 20 | Expired |
| US5688360A | Method and apparatus for polishing a semiconductor substrate wafer | Performing Operations; Transporting | 20 | Expired |
| US6855239B1 | Plating method and apparatus using contactless electrode | Chemistry; Metallurgy | 12 | Expired |
| US6517418B2 | Method of transporting a semiconductor wafer in a wafer polishing system | Performing Operations; Transporting | 8 | Expired |
| US6656025B2 | Integrated pad and belt for chemical mechanical polishing | Performing Operations; Transporting | 3 | Expired |
| US10762524B2 | Data platform and analytics for predicting media metrics | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.