Electroplating process and composition
US5667662A · kind A · utility
7Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1996 |
| Grant date | Sep 16, 1997 |
| Priority date | — |
| Expiry date | Apr 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/92
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer containing a polymeric stabilizer having repeating alkylene oxide groups and a hydrophilic--lipophilic balance of at least 10.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.