Solder interconnection structure and process for making
US5668059A · kind A · utility
56Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1996 |
| Grant date | Sep 16, 1997 |
| Priority date | — |
| Expiry date | Jul 12, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31547
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.