Vertical package mounted on both sides of a printed circuit board
US5671125A · kind A · utility
8Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1995 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | Aug 21, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperature a printed circuit board. The flat packages include leads (120, 121) which extend from an edge of the flat package. A semiconductor chip is encapsulated by the flat packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.