Patent · US Expired

Method of repetitively imaging a mask pattern on a substrate, and apparatus for performing the method

US5673101A · kind A · utility

15Cited by
11References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 25, 1995
Grant dateSep 30, 1997
Priority date
Expiry dateMay 25, 2015

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/70675
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method and apparatus for repetitively imaging a mask pattern (C) on a substrate (W) are described. Various parameters of the apparatus and the projection lens system (PL) can be measured accurately and reliably and measuring devices of the apparatus can be calibrated by measuring a latent image of a mark by means of a scanning microscope (LID) forming a diffraction-limited radiation spot (Sp) on the photoresist layer on the substrate (W), in which layer the latent image is formed by means of a projection beam (PB).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.