Process for preparing a non-conductive substrate for electroplating
US5674372A · kind A · utility
4Cited by
16References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1996 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Sep 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is disclosed for the direct electroplating of a non-conductive material comprising non-conductive surfaces and metallic surfaces. The process involves contacting the non-conductive material with a compound capable of selectively forming a sacrificial layer on the metallic surfaces which sacrificial layer is substantially insoluble in alkaline or neutral media but soluble in acidic media. The foregoing step is followed by deposition of carbon onto the surfaces followed by contact with an acidic solution and subsequent electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.