Method for wet processing of a semiconductor substrate
US5676760A · kind A · utility
53Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1995 |
| Grant date | Oct 14, 1997 |
| Priority date | — |
| Expiry date | Mar 23, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC02F2209/06
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Electrolyzed waters, including an anode water and a cathode water, having either oxidizing or reducing activity and having either acidity or alkalescency, which is obtained by electrolysis of an aqueous solution prepared by addition of a minute amount of electrolytes, is applied wet processings including cleaning, etching and rinsing processings of semiconductor wafers. The effects of the electrolyzed waters are not lower than those the conventional acidic or alkalic chemicals provide, and remarkably reduces quantity of chemicals used in wet processings in semiconductor manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.