Hidemitsu Aoki
70Patents
19h-index
52Co-inventors
83Inventor score
Filing activity: Mar 23, 1995 → Nov 24, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5635053A | Method and apparatus for cleaning electronic parts | Emerging Cross-Sectional Technologies | 59 | Expired |
| US5676760A | Method for wet processing of a semiconductor substrate | Chemistry; Metallurgy | 53 | Expired |
| US6423148B1 | Substrate-cleaning method and substrate-cleaning solution | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5762779A | Method for producing electrolyzed water | Chemistry; Metallurgy | 45 | Expired |
| US5616221A | Electrolytic ionized water producing apparatus | Emerging Cross-Sectional Technologies | 40 | Expired |
| US5543030A | Method for producing electrolyzed water | Chemistry; Metallurgy | 36 | Expired |
| US6225217A | Method of manufacturing semiconductor device having multilayer wiring | Electricity | 35 | Expired |
| US5578193A | Method and apparatus for wet treatment of solid surfaces | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6869921B2 | Stripping composition | Chemistry; Metallurgy | 32 | Expired |
| US5833831A | Method and system for generating electrolyzed water | Electricity | 30 | Expired |
| US6683007B1 | Etching and cleaning methods and etching and cleaning apparatus used therefor | Electricity | 29 | Expired |
| US5599438A | Method for producing electrolyzed water | Chemistry; Metallurgy | 28 | Expired |
| US6787480B2 | Manufacturing method of semicondcutor device | Electricity | 27 | Expired |
| US6080709A | Cleaning solution for cleaning substrates to which a metallic wiring has been applied | Electricity | 22 | Expired |
| US5989919A | Method for analyzing contamination within hole in semiconductor device | Physics | 22 | Expired |
| US6387190B1 | Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring | Electricity | 21 | Expired |
| US6319801A | Method for cleaning a substrate and cleaning solution | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6890391B2 | Method of manufacturing semiconductor device and apparatus for cleaning substrate | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6465352B1 | Method for removing dry-etching residue in a semiconductor device fabricating process | Electricity | 19 | Expired |
| US7312186B2 | Cleaning solution for semiconductor substrate | Chemistry; Metallurgy | 18 | Expired |
| US6036581A | Substrate cleaning method and apparatus | Electricity | 17 | Expired |
| US6524376B2 | Anticorrosive agent | Electricity | 15 | Expired |
| US6592677B1 | Method of forming a semiconductor device by simultaneously cleaning both sides of a wafer using different cleaning solutions | Electricity | 14 | Expired |
| US6964724B2 | Etching and cleaning methods and etching and cleaning apparatuses used therefor | Electricity | 13 | Expired |
| US6444583B2 | Substrate-cleaning method and substrate-cleaning solution | Emerging Cross-Sectional Technologies | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.