Small outline optocoupler package method
US5677245A · kind A · utility
15Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 1995 |
| Grant date | Oct 14, 1997 |
| Priority date | — |
| Expiry date | May 30, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe (10) architecture provides placement of multiple optocoupler pair devices (45, 50) in a minimum size footprint package. A detector flag (20) and LED flag (12) are placed on a common centerline (26) within the footprint. A critical length is determined for packaging factors lying along the centerline. The angle (28) formed between the centerline and the longitudinal axis (24) controls the optocoupler pair fit within the package. The angle (28) is calculated by taking the arc-sine function of the critical length divided by the footprint width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.