Semiconductor package having semiconductor chip mounted on board in face-down relation
US5677575A · kind A · utility
56Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 1996 |
| Grant date | Oct 14, 1997 |
| Priority date | — |
| Expiry date | May 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor package comprises a board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a resin layer filled into a space formed between a surface of the semiconductor chip and the first main surface of the board, flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board, and a dummy wiring pattern formed at an outer-peripheral edge portion of at least one of the first main surface of the board and an inner wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.