Automated wafer lapping system
US5679055A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 1996 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | May 31, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An automated wafer lapping system including a robot which loads wafers from a cassette into a wafer carrier on a lapping machine one at a time and one after another. The robot is capable of delivering lapped wafers to a thickness gauging device for measuring the wafer thickness and recalibrating the lapping machine between each run. Openings in the wafer carriers for receiving wafers are sized closely to the wafer for minimal relative motion between the wafer and carrier. A centering jig and search program for the robot facilitate fast location of the wafers in the openings. The lapping system also inspects wafers for defects and sorts them accordingly after lapping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.