Copper foil for printed circuit boards
US5679230A · kind A · utility
28Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1995 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Aug 21, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A electrolytically deposited copper foil has a roughening treatment of copper on the shiny side and on the matte side a fine nodular metal deposit preferably copper or a copper alloy which improves adhesion to a substrate, but is insufficient to increase the measured surface roughness Rz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.