Oak-Mitsui Inc.
13Patents
3Active
13Granted
35Portfolio score
Filing activity: Aug 21, 1995 → Aug 26, 2009 · 3 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6657849B1 | Formation of an embedded capacitor plane using a thin dielectric | Electricity | 58 | Expired |
| US5679230A | Copper foil for printed circuit boards | Electricity | 28 | Expired |
| US6606792B1 | Process to manufacturing tight tolerance embedded elements for printed circuit boards | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6495244B1 | Manufacturing fire retardant circuit boards without the use of fire retardant resin additives | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6610417B2 | Nickel coated copper as electrodes for embedded passive devices | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7596842B2 | Method of making multilayered construction for use in resistors and capacitors | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7192654B2 | Multilayered construction for resistor and capacitor formation | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6500349B2 | Manufacture of printed circuits using single layer processing techniques | Electricity | 6 | Expired |
| US7413815B2 | Thin laminate as embedded capacitance material in printed circuit boards | Emerging Cross-Sectional Technologies | 6 | Active |
| US7862900B2 | Multilayered construction for use in resistors and capacitors | Emerging Cross-Sectional Technologies | 5 | Active |
| US7672113B2 | Polymer-ceramic composites with excellent TCC | Electricity | 2 | Active |
| US6763575B2 | Printed circuit boards having integrated inductor cores | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6629348B2 | Substrate adhesion enhancement to film | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.